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INTEGRATED CIRCUITS
DATA SHEET
TSA5512 1.3 GHz Bidirectional I2C-bus controlled synthesizer
Product specification File under Integrated Circuits, IC02 October 1992
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
FEATURES * Complete 1.3 GHz single chip system * Low power 5 V, 35 mA * I2C-bus programming * In-lock flag * Varicap drive disable * Low radiation * Address selection for Picture-In-Picture (PIP), DBS tuner (3 addresses) * Analog-to-digital converter * 8 bus controlled ports (6 for TSA5512T), 8 open collector outputs (4 bidirectional) * Power-down flag APPLICATIONS * TV tuners * VCR Tuners ORDERING INFORMATION EXTENDED TYPE NUMBER TSA5512 TSA5512T TSA5512AT TSA5512M Note 1. SOT102-1; 1996 December 5. 2. SOT109-1; 1996 December 5. 3. SOT163-1; 1996 December 5. 4. SOT266-1; 1996 December 5. PACKAGE PINS 18 16 20 20 PIN POSITION DIL SO SO SSOP MATERIAL plastic plastic plastic plastic DESCRIPTION
TSA5512
The TSA5512 is a single chip PLL frequency synthesizer designed for TV tuning systems. Control data is entered via the I2C-bus; five serial bytes are required to address the device, select the oscillator frequency, programme the eight output ports and set the charge-pump current. Four of these ports can also be used as input ports (three general purpose I/O ports, one ADC). Digital information concerning those ports can be read out of the TSA5512 on the SDA line (one status byte) during a READ operation. A flag is set when the loop is "in-lock" and is read during a READ operation. The device has one fixed I2C-bus address and 3 programmable addresses, programmed by applying a specific voltage on Port 3. The phase comparator operates at 7.8125 kHz when a 4 MHz crystal is used.
CODE SOT102(1) SOT109A(2) SOT163A(3) SOT266(4)
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Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
QUICK REFERENCE DATA SYMBOL VCC ICC fr VI supply voltage supply current frequency range input voltage level 80 MHz to 150 MHz 150 MHz to 1 GHz 1 GHz to 1.3 GHz fXTAL IO Tamb Tstg crystal oscillator frequency open-collector output current operating ambient temperature range IC storage temperature range 12 9 40 3.2 5 -10 -40 - - - 4.0 - - - 300 300 300 4.48 - +80 +150 PARAMETER - - 64 MIN. 5 35 - TYP. - - 1300
TSA5512
MAX. V
UNIT mA MHz mV mV mV MHz mA C C
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Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
October 1992
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Fig.1 Block diagram.
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
Fig.2 Pin configuration for SOT102.
Fig.3 Pin configuration for SOT109.
Fig.4 Pin configuration for SOT163/SOT266.
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Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
PINNING PIN SYMBOL SOT102 SOT109 PD Q1 Q2 n.c. SDA SCL P7 n.c. P6 P5 P4 P3 P2 P1 P0 VCC RFIN1 RFIN2 VEE UD 1 2 3 - 4 5 6 - 7 8 9 10 11 12 13 14 15 16 17 18 1 2 3 - 4 5 6 - 7 8 9 10 11 - - 12 13 14 15 16 SOT163 SOT266 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 charge-pump output crystal oscillator input 1 crystal oscillator reference voltage not connected serial data input/output serial clock input port output/input (general purpose) not connected port output/input for general purpose ADC port output/input (general purpose) port output/input (general purpose) port output/input for address selection port output port output port output voltage supply UHF/VHF signal input 1 UHF/VHF signal input 2 (decoupled) ground drive output DESCRIPTION
TSA5512
FUNCTIONAL DESCRIPTION The TSA5512 is controlled via the two-wire I2C-bus. For programming, there is one module address (7 bits) and the R/W bit for selecting READ or WRITE mode. WRITE mode: R/W = 0 (see Table 1) After the address transmission (first byte), data bytes can be sent to the device. Four data bytes are required to fully program the TSA5512. The bus transceiver has an auto-increment facility which permits the programming of the TSA5512 within one single transmission (address + 4 data bytes). The TSA5512 can also be partially programmed on the condition that the first data byte following the address is byte 2 or byte 4. The meaning of the bits in the data bytes is given in Table 1. The first bit of the first data byte transmitted indicates whether frequency data (first bit = 0) or charge pump and port information (first bit = 1) will follow. Until an I2C-bus STOP condition is sent by the controller, additional data bytes can be entered without the need to re-address the device. This allows a smooth frequency sweep for fine tuning or AFC purpose. At power-on the ports are set to the high impedance state. The 7.8125 kHz reference frequency is obtained by dividing the output of the 4 MHz crystal oscillator by 512. Because the input of UHF/VHF signal is first divided by 8 the step size is 62.5 kHz. A 3.2 MHz crystal can offer step sizes of 50 kHz.
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Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
Table 1 Write data format MSB Address Programmable divider Programmable divider Charge-pump and test bits Output ports control bits Note to Table 1 * MA1,MAO A N14 to N0 N = N14 x CP CP = 0 CP = 1 P7 to P0 = 1 P7 to P0 = 0 T1, T0, OS = 0 0 0 T1 = 1 T0 = 1 OS = 1 214 + N13 x 213 +... +N1 x 21 + not valid for TSA5512T programmable address bits (see Table 4) acknowledge bit programmable divider bits NO charge-pump current 50 A 220 A open-collector output is active outputs are in high impedance state normal operation P6 = fref, P7 = fDIV 3-state charge-pump 1 0 N7 1 P7 1 N14 N6 CP P6 0 N13 N5 T1 P5 0 N12 N4 T0 P4 0 N11 N3 1 P3 MA1 N10 N2 1 P2 MA0 N9 N1 1 P1* LSB 0 N8 N0 OS P0* A A A A A
TSA5512
byte 1 byte 2 byte 3 byte 4 byte 5
operational amplifier output is switched off (varicap drive disable)
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Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
READ mode: R/W = 1 (see Table 2)
TSA5512
Data can be read out of the TSA5512 by setting the R/W bit to 1. After the slave address has been recognized, the TSA5512 generates an acknowledge pulse and the first data byte (status word) is transferred on the SDA line (MSB first). Data is valid on the SDA line during a high position of the SCL clock signal. A second data byte can be read out of the TSA5512 if the processor generates an acknowledge on the SDA line. End of transmission will occur if no acknowledge from the processor occurs. The TSA5512 will then release the data line to allow the processor to generate a STOP condition. When ports P3 to P7 are used as inputs, they must be programmed in their high-impedance state. The POR flag (power-on reset) is set to 1 when VCC goes below 3 V and at power-on. It is reset when an end of data is detected by the TSA5512 (end of a READ sequence). Control of the loop is made possible with the in-lock flag FL which indicates (FL = 1) when the loop is phase-locked. The bits I2, I1 and I0 represent the status of the I/O ports P7, P5 and P4 respectively. A logic 0 indicates a LOW level and a logic 1 a HIGH level (TTL levels). A built-in 5-level ADC is available on I/O port P6. This converter can be used to feed AFC information to the controller from the IF section of the television as illustrated in the typical application circuit (Fig.8). The relationship between bits A2, A1 and A0 and the input voltage on port P6 is given in Table 3. Table 2 Read data format MSB Address Status byte Note to Table 2 POR FL I2, I1, I0 A2, A1 A0 power-on reset flag. (POR = 1 on power-on) in-lock flag (FL = 1 when the loop is phase-locked) digital information for I/O ports P7, P5 and P4 respectively digital outputs of the 5-level ADC. Accuracy is 1/2 LSB (see Table 3) 1 POR 1 FL 0 I2 0 I1 0 I0 MA1 A2 MA0 A1 LSB 1 A0 A - byte 1 byte 2
MSB is transmitted first Address selection The module address contains programmable address bits (MA1 and MA0) which together with the I/O port P3 offers the possibility of having several synthesizers (up to 3) in one system. The relationship between MA1 and MA0 and the input voltage I/O port P3 is given in Table 4
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Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
Table 3 ADC levels VOLTAGE APPLIED ON THE PORT P6 0.6 VCC to 13.5 V 0.45 VCC to 0.6 VCC 0.3 VCC to 0.45 VCC 0.15 VCC to 0.3 VCC 0 to 0.15 VCC Table 4 Address selection MA1 0 0 1 1 MA0 0 1 0 1 0 to 0.1 VCC always valid 0.4 to 0.6 VCC 0.9 VCC to 13.5 V VOLTAGE APPLIED ON PORT P3 A2 1 0 0 0 0 A1 0 1 1 0 0
TSA5512
A0 0 1 0 1 0
LIMITING VALUES In accordance with Absolute Maximum Rating System (IEC 134); all pin numbers refer to DIL18 version SYMBOL VCC V1 V2 V4 V5 V6-13 V15 V18 I6-13 I4 Tstg Tj THERMAL RESISTANCE SYMBOL Rth
j-a
PARAMETER supply voltage charge-pump output voltage crystal (Q1) input voltage serial data input/output voltage serial clock input voltage P7 to P0 input/output voltage prescaler input voltage drive output voltage P7 to P0 output current (open collector) SDA output current (open collector) IC storage temperature range maximum junction temperature
MIN. -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -1 -1 -40 - 6
MAX. V V V V V V V V VCC VCC 6 6 +16 VCC VCC 15 5 +150 150
UNIT
mA mA C C
PARAMETER from junction to ambient in free air DIL18 SO16 SO20 SSOP20
THERMAL RESISTANCE 80 K/W 110 K/W 80 K/W 120 K/W
October 1992
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Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
CHARACTERISTICS VCC = 5 V; Tamb = 25 C, unless otherwise specified All pin numbers refer to DIL18 version SYMBOL Functional range VCC Tamb f N ICC fXTAL ZI supply voltage range operating ambient temperature range input frequency divider supply current crystal oscillator frequency range input impedance (pin 2) input level VCC = 4.5 V to 5.5 V; Tamb = -10 to +80 C; see typical sensitivity curve Fig.6 12/-25 9/-28 40/-15 - - - - - -10 - 2.7 VIH = 13.5 V VIL = 0 V VIH = 13.5 V VIL = 0 V - -10 - -10 - - - 50 2 - - - - - - - - - - - - crystal series resonance resistance 150 4.5 -10 64 256 25 3.2 -480 - - - - 35 4.0 -400 5.5 +80 1300 PARAMETER CONDITIONS MIN. TYP.
TSA5512
MAX.
UNIT
V C MHz mA MHz
32767 50 4.48 -320
f = 80 to 150 MHz f = 150 to 1000 MHz f = 1000 to 1300 MHz RI CI ILO VOL IOH IOL VIL VIH IIH IIL IIH IIL VIH VIL prescaler input resistance (see Fig.7) input capacitance
300/2.6 300/2.6 300/2.6 - -
mV/dBm mV/dBm mV/dBm pF A V A A
Output ports (open collector) P0 to P7 (see note 1) output leakage current LOW level output voltage VO = 13.5 V IOL = 5 mA; note 2 VOH = 13.5 V VOL = 0 V 10 0.7
Input port P3 HIGH level input current LOW level input current 10 -
Input ports P4, P5 and P7 LOW level input voltage HIGH level input voltage HIGH level input current LOW level input current 0.8 - 10 - V V A A A A
Input port P6 HIGH level input current LOW level input current 10 -
SCL and SDA inputs HIGH level input voltage LOW level input voltage 3.0 - 5.5 1.5 V V
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Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
SYMBOL
PARAMETER
CONDITIONS - -
MIN. - - - - - -
TYP.
MAX.
UNIT A A A A A V A A V nA
SCL and SDA inputs IIH IIL HIGH level input current LOW level input current VIH = 5 V; VCC = 0 V VIH = 5 V; VCC = 5 V VIL = 0 V; VCC = 0 V VIL = 0 V; VCC = 5 V Output SDA (pin 4; open collector) ILO VO IOH IOL V1 I1leak V18 V18 G output leakage current output voltage VO = 5.5 V IO = 3 mA CP = 1 CP = 0 in-lock T0 = 1 - - 10 0.4 10 10 - -
-10 -10
Charge-pump output PD (pin 1) HIGH level output current (absolute value) LOW level output current (absolute value) output voltage off-state leakage current 90 22 1.5 -5 - - 2000 220 50 - - - - - 300 75 2.5 5
Operational amplifier output UD (test mode T0 = 1) output voltage output voltage when switched-off operational amplifier current gain; I18/(I1 - I1leak) VIL = 0 V OS = 1; VIL = 2 V OS = 0; VIL = 2 V; I18 = 10 A 100 200 - mV mV
Notes to the characteristics 1. When a port is active, the collector voltage must not exceed 6 V. 2. Measured with all open-collector ports active.
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Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
October 1992
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Fig.5 Typical application (DIL18).
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
Fig.6 Prescaler typical input sensitivity curve; VCC = 4.5 to 5.5 V; Tamb = -10 to +80 C.
Fig.7 Prescaler Smith chart of typical input impedance; VCC = 5 V; reference value = 50 .
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Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
FLOCK FLAG DEFINITION (FL)
TSA5512
When the FL flag is 1, the maximum frequency deviation (f) from stable frequency can be expressed as follows: f = ( K VCO K O ) x I CP x ( C1 + C2 ) ( C1 x C2 ) Where: KVCO ICP KO C1 and C2 = = = = oscillator slope (Hz/V) charge-pump current (A) 4 x 10E6 loop filter capacitors (see Fig.8)
Fig.8 Loop filter.
FLOCK FLAG APPLICATION * KVCO = 16 MHz/V (UHF band) * ICP = 220 mA * C1 = 180 nF * C2 = 39 nF * f = 27.5 kHz. Table 5 Flock flag settings MIN. Time span between actual phase lock and FL-flag setting Time span between the loop losing lock and FL-flag resetting 1024 0 1152 128 MAX. s s UNIT
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Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
PACKAGE OUTLINE DIP18: plastic dual in-line package; 18 leads (300 mil)
TSA5512
SOT102-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 18 10 b2 MH wM (e 1)
pin 1 index E
1
9
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.044 b1 0.53 0.38 0.021 0.015 b2 1.40 1.14 0.055 0.044 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 0.85 0.033
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT102-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-10-14 95-01-23
October 1992
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Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp 1 e bp 8 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-23 97-05-22
October 1992
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Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)
0.9 0.4
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.050 0.055 0.394 0.016
0.035 0.004 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
October 1992
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Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
D
E
A X
c y HE vM A
Z
20
11
Q A2 pin 1 index A1 (A 3) Lp L A
1
e bp
10
detail X wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.5 A1 0.15 0 A2 1.4 1.2 A3 0.25 bp 0.32 0.20 c 0.20 0.13 D (1) 6.6 6.4 E (1) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.45 Q 0.65 0.45 v 0.2 w 0.13 y 0.1 Z (1) 0.48 0.18 10 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT266-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 90-04-05 95-02-25
October 1992
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Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO and SSOP REFLOW SOLDERING Reflow soldering techniques are suitable for all SO and SSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating
TSA5512
method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions, only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
October 1992
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Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TSA5512
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
October 1992
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